AMKR - アムコ―・テクノロジ― （Amkor Technology Inc.） アムコ―・テクノロジ―AMKRのチャート
AMKRの企業情報
| symbol | AMKR |
|---|---|
| 会社名 | Amkor Technology Inc. （アムコ―・テクノロジ―） |
| 分野（sector） | Technology ハイテク |
| 産業（industry） | Semiconductors |
| 業種 | 半導体製造装置_試験装置 IT・通信（IT_Communications） |
| 概要 | 事業概要 アムコー・テクノロジー（Amkor Technology Inc.）は外部委託半導体パッケージングとテストサービスのプロバイダーである。同社のパッケージングとテストサービスは相互接続技術の種類、サイズ、厚さ、及び電気的・機械的・熱的性能を含むチップ特定用件とアプリケーションに基づいて設計される。同社は半導体ウェーハ・バンプ、ウェーハ・プローブ、ウェーハ・バックグラインド、パッケージデザイン、パッケージング、システムレベル、および最終的なテストおよびドロップ出荷サービスを含むパッケージングとテストサービスを提供する。同社は統合デバイス製造業者（IDM）、ファブレス半導体企業と契約ファンドリーにサービスを提供する。IDMは、自社の施設で半導体の設計、製造、パッケージングおよびテストを行う。同社は、主流パッケージングおよびテストサービスを提供する。同社の主流パッケージにはリードフレームパッケージ、基板ベースのワイヤボンドパッケージ、マイクロエレクトロメカニカルシステムパッケージなどを含む。 アムコ―・テクノロジ―は、米国の半導体組み立て・試験サ―ビスのプロバイダ―。外部委託により事業を展開し、半導体ウエハ―の組み立て、調整、配線、パッケ―ジング、評価・テスト・解析および配送などのサ―ビスを提供する。パッケ―ジングには格子配列やリ―ドフレ―ムによるものを含む。本社はアリゾナ州。 Amkor Technology, Inc. is one of the world's largest providers of outsourced semiconductor packaging and test services. Founded in 1968, Amkor pioneered the outsourcing of IC packaging and test and is now a strategic manufacturing partner for the world's leading semiconductor companies, foundries and electronics OEMs. Amkor's operational base includes production facilities, product development centers, and sales and support offices located in key electronics manufacturing regions in Asia, Europe and the USA. |
| 本社所在地 | 2045 East Innovation Circle Tempe AZ 85284 USA |
| 代表者氏名 | James J. Kim James J. Kim |
| 代表者役職名 | Executive Chairman of the Board 取締役会長 |
| 電話番号 | +1 480-821-5000 |
| 設立年月日 | 35674 |
| 市場名 | NASDAQ National Market System |
| ipoyear | 1998年 |
| 従業員数 | 29300人 |
| url | www.amkor.com |
| nasdaq_url | https://www.nasdaq.com/symbol/amkr |
| adr_tso | ― |
| EBITDA | EBITDA（百万ドル） 878.81200 |
| 終値（lastsale） | 6.9 |
| 時価総額（marketcap） | 1652814849.6 |
| 時価総額 | 時価総額（百万ドル） 1640.838 |
| 売上高 | 売上高（百万ドル） 4374.453 |
| 企業価値(EV) | 企業価値(EV)（百万ドル） 2590.168 |
| 当期純利益 | 当期純利益（百万ドル） 155.78600 |
| 決算概要 | 決算概要 BRIEF: For the six months ended 30 June 2018 Amkor Technology Inc. revenues increased 10% to $2.09B. Net income decreased 60% to $42.1M. Revenues reflect Advanced products segment increase of 18% to $972M Mainstream products segment increase of 3% to $1.12B. Net income was offset by Gain on sale of real estate decrease from $108.1M (income) to $0K Selling general and administrative increase of 8% to $155.4M (expense). |
AMKRのテクニカル分析
AMKRのニュース
Insights on the Semiconductor Assembly and Packaging Services Global Market to 2027 - Featuring Amkor Technology, ASE Group and Intel Among Others 2021/02/23 17:00:00 PR Newswire
DUBLIN, Feb. 23, 2021 /PRNewswire/ -- The "Semiconductor Assembly and Packaging Services - Global Market Trajectory & Analytics" report has been added to ResearchAndMarkets.com's offering. The publisher brings years of research experience to the 6th edition of this report. The 142-page…
Power Integrations (NASDAQ:POWI) and Amkor Technology (NASDAQ:AMKR) Financial Contrast 2021/02/20 08:16:56 Modern Readers
Amkor Technology (NASDAQ:AMKR) and Power Integrations (NASDAQ:POWI) are both mid-cap computer and technology companies, but which is the superior stock? We will contrast the two companies based on the strength of their valuation, dividends, earnings, analyst recommendations, profitability, institutional ownership and risk. Profitability This table compares Amkor Technology and Power Integrations’ net margins, return on […]
Worldwide Automotive Power Module Packaging Industry to 2026 - Asia-Pacific is Expected to Register the Highest Growth Rate - ResearchAndMarkets.com 2021/02/17 13:30:00 Business Wire
DUBLIN--(BUSINESS WIRE)--The "Automotive Power Module Packaging Market - Growth, Trends, COVID-19 Impact, and Forecasts (2021 - 2026)" report has been added to ResearchAndMarkets.com's offering. The automotive power module packaging market is expected to grow with a CAGR of 7.5%, over the forecast period (2021 - 2026). Companies Mentioned Amkor Technology Kulicke and Soffa Industries Inc. PTI Technology Inc. Infineon Technologies STMicroelectronics Fuji Electric Co. Ltd. Toshiba Electronic Devi
Amkor Technology Reports Financial Results for the Fourth Quarter and Full Year 2020 2021/02/08 21:03:00 Business Wire
TEMPE, Ariz.--(BUSINESS WIRE)--Amkor Technology, Inc. (NASDAQ: AMKR), a leading provider of semiconductor packaging and test services, today announced financial results for the fourth quarter and full year ended December 31, 2020. “Better than expected demand for smartphone and automotive products drove fourth quarter revenue up 16% year on year to a record $1.37 billion,” said Giel Rutten, Amkor’s president and chief executive officer. “For full year 2020, we delivered record revenue of $5.05
Amkor Technology to Announce Fourth Quarter and Full Year 2020 Financial Results on February 8, 2021 2021/01/18 22:21:00 Business Wire
TEMPE, Ariz.--(BUSINESS WIRE)--Amkor Technology to Announce Fourth Quarter and Full Year 2020 Financial Results on February 8, 2021
Power Integrations (NASDAQ:POWI) and Amkor Technology (NASDAQ:AMKR) Financial Contrast 2021/02/20 08:16:56 Modern Readers
Amkor Technology (NASDAQ:AMKR) and Power Integrations (NASDAQ:POWI) are both mid-cap computer and technology companies, but which is the superior stock? We will contrast the two companies based on the strength of their valuation, dividends, earnings, analyst recommendations, profitability, institutional ownership and risk. Profitability This table compares Amkor Technology and Power Integrations’ net margins, return on […]
Worldwide Automotive Power Module Packaging Industry to 2026 - Asia-Pacific is Expected to Register the Highest Growth Rate - ResearchAndMarkets.com 2021/02/17 13:30:00 Business Wire
DUBLIN--(BUSINESS WIRE)--The "Automotive Power Module Packaging Market - Growth, Trends, COVID-19 Impact, and Forecasts (2021 - 2026)" report has been added to ResearchAndMarkets.com's offering. The automotive power module packaging market is expected to grow with a CAGR of 7.5%, over the forecast period (2021 - 2026). Companies Mentioned Amkor Technology Kulicke and Soffa Industries Inc. PTI Technology Inc. Infineon Technologies STMicroelectronics Fuji Electric Co. Ltd. Toshiba Electronic Devi
Amkor Technology Reports Financial Results for the Fourth Quarter and Full Year 2020 2021/02/08 21:03:00 Business Wire
TEMPE, Ariz.--(BUSINESS WIRE)--Amkor Technology, Inc. (NASDAQ: AMKR), a leading provider of semiconductor packaging and test services, today announced financial results for the fourth quarter and full year ended December 31, 2020. “Better than expected demand for smartphone and automotive products drove fourth quarter revenue up 16% year on year to a record $1.37 billion,” said Giel Rutten, Amkor’s president and chief executive officer. “For full year 2020, we delivered record revenue of $5.05
Amkor Technology to Announce Fourth Quarter and Full Year 2020 Financial Results on February 8, 2021 2021/01/18 22:21:00 Business Wire
TEMPE, Ariz.--(BUSINESS WIRE)--Amkor Technology to Announce Fourth Quarter and Full Year 2020 Financial Results on February 8, 2021
Outlook on the Organic Substrate Packaging Material Global Market to 2025 - Impact Analysis of COVID-19 2020/12/31 19:45:00 Benzinga
DUBLIN , Dec. 31, 2020 /PRNewswire/ -- The "Organic Substrate Packaging Material Market: Global Industry Trends, Share, Size, Growth, Opportunity and Forecast 2020-2025" report has been added to ResearchAndMarkets.com's offering. The global organic substrate packaging material market grew at a CAGR of around 6% during 2014-2019. Organic substrate packaging materials are utilized on the foundation layer of printed circuit boards (PCBs) to provide high reliability and outstanding electrical performance. These packaging materials reduce the overall weight of PCBs and increase their functionality and dimensional control. Besides this, they assist in minimizing the environmental impact of PCBs as compared to their inorganic counterparts. Consequently, the demand for organic substrate packaging materials is escalating across the globe. A significant rise in the demand for portable electronic devices, in confluence with the advancements in information and communication technology (ICT), represents one of the key factors impelling the global organic substrate packaging materials market growth.
Power Integrations (NASDAQ:POWI) and Amkor Technology (NASDAQ:AMKR) Financial Contrast 2021/02/20 08:16:56 Modern Readers
Amkor Technology (NASDAQ:AMKR) and Power Integrations (NASDAQ:POWI) are both mid-cap computer and technology companies, but which is the superior stock? We will contrast the two companies based on the strength of their valuation, dividends, earnings, analyst recommendations, profitability, institutional ownership and risk. Profitability This table compares Amkor Technology and Power Integrations’ net margins, return on […]
Worldwide Automotive Power Module Packaging Industry to 2026 - Asia-Pacific is Expected to Register the Highest Growth Rate - ResearchAndMarkets.com 2021/02/17 13:30:00 Business Wire
DUBLIN--(BUSINESS WIRE)--The "Automotive Power Module Packaging Market - Growth, Trends, COVID-19 Impact, and Forecasts (2021 - 2026)" report has been added to ResearchAndMarkets.com's offering. The automotive power module packaging market is expected to grow with a CAGR of 7.5%, over the forecast period (2021 - 2026). Companies Mentioned Amkor Technology Kulicke and Soffa Industries Inc. PTI Technology Inc. Infineon Technologies STMicroelectronics Fuji Electric Co. Ltd. Toshiba Electronic Devi
Amkor Technology Reports Financial Results for the Fourth Quarter and Full Year 2020 2021/02/08 21:03:00 Business Wire
TEMPE, Ariz.--(BUSINESS WIRE)--Amkor Technology, Inc. (NASDAQ: AMKR), a leading provider of semiconductor packaging and test services, today announced financial results for the fourth quarter and full year ended December 31, 2020. “Better than expected demand for smartphone and automotive products drove fourth quarter revenue up 16% year on year to a record $1.37 billion,” said Giel Rutten, Amkor’s president and chief executive officer. “For full year 2020, we delivered record revenue of $5.05
Amkor Technology to Announce Fourth Quarter and Full Year 2020 Financial Results on February 8, 2021 2021/01/18 22:21:00 Business Wire
TEMPE, Ariz.--(BUSINESS WIRE)--Amkor Technology to Announce Fourth Quarter and Full Year 2020 Financial Results on February 8, 2021
Outlook on the Organic Substrate Packaging Material Global Market to 2025 - Impact Analysis of COVID-19 2020/12/31 19:45:00 Benzinga
DUBLIN , Dec. 31, 2020 /PRNewswire/ -- The "Organic Substrate Packaging Material Market: Global Industry Trends, Share, Size, Growth, Opportunity and Forecast 2020-2025" report has been added to ResearchAndMarkets.com's offering. The global organic substrate packaging material market grew at a CAGR of around 6% during 2014-2019. Organic substrate packaging materials are utilized on the foundation layer of printed circuit boards (PCBs) to provide high reliability and outstanding electrical performance. These packaging materials reduce the overall weight of PCBs and increase their functionality and dimensional control. Besides this, they assist in minimizing the environmental impact of PCBs as compared to their inorganic counterparts. Consequently, the demand for organic substrate packaging materials is escalating across the globe. A significant rise in the demand for portable electronic devices, in confluence with the advancements in information and communication technology (ICT), represents one of the key factors impelling the global organic substrate packaging materials market growth.