ANSS - アンシス （ANSYS Inc.）

ANSYS press release (ANSS): Q4 Non-GAAP EPS of $2.81 beats by $0.09.Revenue of $655.7M (+5.1% Y/Y) beats by $10.3M.For Q1, the company expects revenue between $391.6M to $416.6M vs

Initiates Q1 and FY 2022 Outlook Initiates Q1 and FY 2022 Outlook

ANSYS (NASDAQ:ANSS) is scheduled to announce Q4 earnings results on Wednesday, February 23rd, after market close.The consensus EPS Estimate is $2.73 (-7.8% Y/Y) and the consensus

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DUBLIN--(BUSINESS WIRE)--The "Aerospace and Defence Industry - Computer Aided Engineering (CAE) 2021 Market Report: Market Size and Growth; 4-Year Forecast; Market Size, Growth and Position for Each of the Top 5 Vendors" report has been added to ResearchAndMarkets.com''s offering. Data in this Computer Aided Engineering Market report is provided in Software Revenue and Total Revenue terms. Companies Mentioned Ansys Siemens Digital Industries Software Hexagon Dassault Systemes Altair Engineering

Major players in the digital aerospace MRO market are IBM Corporation, IFS AB, Ramco Systems, Rusada, Boeing, Swiss Aviation Software AG, Lufthansa Technik, General Electric, Honeywell International, HCL Technologies Limited, Oracle Corporation, Traxxall Technologies, Ansys, Capgemini, Hexaware Technologies, Winair, and Microsoft Corporation. Major players in the digital aerospace MRO market are IBM Corporation, IFS AB, Ramco Systems, Rusada, Boeing, Swiss Aviation Software AG, Lufthansa Technik, General Electric, Honeywell International, HCL Technologies Limited, Oracle Corporation, Traxxall Technologies, Ansys, Capgemini, Hexaware Technologies, Winair, and Microsoft Corporation.

Global Computer Aided Engineering Market 2021 - Top Vendors Include Autodesk, Ansys and Hexagon - ResearchAndMarkets.com Business Wire

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Regarding the trend, note that the strongest trend exists on the 100 hour timeframe. The post Ansys Inc (ANSS): Price Up $0.7 (0.21)% Over Past Day, Up $0.48 (0.14)% Over Past Hour appeared first on ETF Daily News .

Ansys has achieved certification of its cutting-edge multiphysics signoff solutions for TSMC''s advanced N3 and N4 process technologies, according to the EDA company. This enables joint customers to meet critical power, thermal and reliability standards for highly sophisticated artificial intelligence/machine learning, 5G, high-performance computing (HPC), networking and autonomous vehicle chips.