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  公式動画＆関連する動画 [How Qualcomm Plans to Break AI's Memory Bottleneck]

  QCOM
As AI models grow larger, today's AI infrastructure depends on moving massive amounts of data between processors and high-bandwidth memory (HBM), driving up power consumption, heat, and complexity. At Qualcomm Investor Day 2026, Tony Pialis, EVP and GM of Data Center, explained how Qualcomm is rethinking AI compute architecture to overcome this memory bottleneck and enable more efficient AI scaling. Highlights include: •Qualcomm's new architecture places AI compute directly beneath DRAM, minimizing the need to move data across the system •By reducing data movement, the approach can lower power consumption and heat generation while improving overall efficiency •The design eliminates the need for costly silicon interposers and enables multiple HPC stacks to be deployed using standard packaging Explore the Qualcomm Dragonfly data center portfolio: https://www.qualcomm.com/data-center #AI #QCOM
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