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  公式動画&関連する動画 [TI's power modules utilize MagPack™ packaging technology for improved EMI performance]

TI's power modules with MagPack™ packaging technology feature proprietary magnetic mold compound technology and are a feature of our switching regulators with mitigated, interference and noise technology (MINT). When comparing modules using traditional exposed inductor or side-by-side constructing, devices with MagPack technology perform better in EMI testing due to the inherent shielding that comes from the packaging technology. Breaking the mold: How a new magnetic packaging technology will reshape the future of power modules https://www.ti.com/about-ti/newsroom/company-blog/breaking-the-mold-how-a-new-magnetic-packaging-technology-will-reshape-the-future-of-power-modules.html Double the density: reshaping power modules with MagPack™ technology https://www.ti.com/video/6366749473112 MagPack™ technology: Four benefits of new power modules that can help you pack more power in less space https://www.ti.com/document-viewer/lit/html/ssztd42
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