As AI applications and compute power skyrocket, the power density of data center racks is reaching critical levels. Traditional air cooling is no longer enough. How can engineers manage this thermal challenge? In this keynote, Patrick Zeng, Sector general manager for data center thermal management at Texas Instruments, explores the technical inflection points driving the industry toward advanced liquid cooling. Discover how TI’s precision analog and embedded processing solutions are helping engineers solve complex thermal management challenges to enable next-generation data centers. Key topics covered: • The shift from air cooling to liquid cooling as rack density increases • The overall architecture of next-gen data center thermal management • TI solutions for facility-level HVAC systems to rack-level CDUs and tray-level cooling • Emerging trends and technologies for predictive maintenance and optimized thermal management Subscribe To "Texas Instruments" Channel: https://www.youtube.com/channel/UC-EXTfLnOmCKVRJrv8xoGrQ Learn more about data center cooling https://www.ti.com/applications/data-center/rack-power-thermal-management/overview.html Read about the latest trends in data center cooling https://www.ti.com/about-ti/behind-chip/articles/data-centers-are-generating-more-heat-than-ever-cooling-has-to-keep-up.html Watch the evolution of data center cooling https://www.youtube.com/watch?v=RuE-BpHU1H0 Connect with Texas Instruments: Visit TI WEBSITE: https://www.ti.com/ Follow TI on FACEBOOK: https://www.facebook.com/texasinstruments Follow TI on INSTAGRAM: https://www.instagram.com/txinstruments/ Follow TI on LINKEDIN: https://www.linkedin.com/company/texas-instruments/

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