Applied has the industry’s broadest suite of materials capabilities for fabricating devices on semiconductor wafers. From depositing layers of material on a wafer’s surface to changing the properties of the material, then shaping and removing materials with atomic precision. Our portfolio includes traditional process steps, including metrology and inflection-driven selective processes. © 2023, Applied Materials, Inc. All rights reserved. Any unauthorized use, including reproductions, modification, distribution or publication, without the prior written consent of Applied Materials, Inc., is strictly prohibited.

 10404      266