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DRAM Master Class: Panel-based Packaging
Applied Materials   2026-08-25 に公開
  AI is pushing package sizes beyond the practical limits of traditional silicon interposers—driving the industry toward a new packaging paradigm. Watch Dr. Jinho An, Seni   ...more
Deliver Material Innovation at Applied Materials
Applied Materials   2026-08-24 に公開
  Applied Materials is the global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. We design, build and   ...more
DRAM Master Class: 3D DRAM
Applied Materials   2026-08-19 に公開
  Pathfinding work on 3D DRAM is already underway, laying the foundation for the next era of memory innovation and AI computing. Watch Dr. Sony Varghese, Managing Director   ...more
DRAM Master Class: CMOS-Bonded Arrays
Applied Materials   2026-08-19 に公開
  DRAM scaling is no longer just about shrinking cells—it's about rethinking the architecture. Watch Dr. Sony Varghese, Managing Director of Technology Strategy in the Sem   ...more
DRAM Master Class: AI Scaling(clip)
Applied Materials   2026-08-06 に公開
  AI scaling is no longer just about faster processors—it's about keeping them fed with data. As AI evolves toward agentic workflows with longer context windows, memory ar   ...more
Centris Spectral SiN ALD
Applied Materials   2026-08-06 に公開
  As semiconductor devices continue to scale, manufacturers face increasing challenges in depositing high‑quality dielectric silicon nitride (SiN) films within complex 3D s   ...more