High-bandwidth memory (HBM) has become a foundational technology for the AI era, delivering the bandwidth needed to keep increasingly powerful AI processors fed with data. Achieving these bandwidth gains requires stacking more DRAM, driving the industry’s transition to 12-layer HBM stacks and beyond. However, as die are thinned to meet package height requirements, warpage becomes increasingly difficult to control. Watch Dr. Jinho An, Senior Director of Heterogeneous Integration in the Semiconductor Products Group, explain how Applied's new Producer Avila 2 PECVD system helps manufacturers overcome this challenge and advance the next generation of HBM. #MakeItMaterial

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