The ability to detect and characterize tiny, buried defects in emerging logic and memory chip designs is surpassing the imaging capabilities of conventional eBeam technology. In short, you can’t fix what you can’t see. This is where cold field emission (CFE) technology comes in. Long regarded as the optimal eBeam technology, CFE operates at room temperature, resulting in narrower, higher-energy electron beams that produce higher resolution and faster imaging speed compared to conventional thermal field emission (TFE) technology which operates at temperatures exceeding 1,500 degrees Celsius. Process engineers can tune the CFE eBeam system for maximum resolution or they can lower the resolution to match that of TFE but with significantly faster imaging speed. This animation illustrates the resolution and speed differences between CFE and TFE. © 2022, Applied Materials, Inc. All rights reserved. Any unauthorized use, including reproductions, modification, distribution or publication, without the prior written consent of Applied Materials, Inc., is strictly prohibited.

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