The new enhanced Black Diamond™ low-k dielectric is a revolutionary product, enabling next-generation chips of the AI era. Black Diamond™ addresses two key issues in leading-edge chips. As wires become closer together, parasitic capacitance increases. The phenomenon slows signals down, worsening performance and energy consumption. Additionally, damaging plasma manufacturing processes can cause the thinner insulating dielectric material between wires to fracture or collapse, potentially leading to chip failure. Learn more: https://www.appliedmaterials.com/us/en/product-library/producer-black-diamond-pecvd.html © 2025, Applied Materials, Inc. All rights reserved. Any unauthorized use, including reproductions, modification, distribution or publication, without the prior written consent of Applied Materials, Inc., is strictly prohibited.

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