Discover how Applied Materials’ Kinex™ system is redefining hybrid bonding for advanced chiplet integration. Kinex’s breakthrough die-to-wafer bonding process, enabling ultra-dense copper and dielectric interconnects with nanometer precision. Watch as chiplets undergo plasma activation, hydration, and alignment inside the Besi hybrid bonder – culminating in a high-temperature fusion that delivers unmatched performance and yield. Built on three pillars of process integration, chiplet management, and metrology, Kinex empowers chipmakers to scale AI accelerators with taller, more powerful 3D architectures.

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